Laser blind hole inspection machine

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1. Comprehensive defect inspection and dimensional measurement of laser drilling.

2. Using ultra-high resolution line scan imaging system, the scanning detection speed is fast, and all blind holes on the HDI can be fully checked.

3. Equipped with a variety of analysis tools such as arrow target map and distribution map.

4. MMI operation is simple and efficient.

5. Wide applicability, can be applied to Large Window, conformal, DLD and other processes.

6. Tailored for laser blind holes, it can detect laser drilling hole size, residual glue in the hole, leakage drilling and other defects.

7. Built-in Al anti-fake point and deep leaming function, which greatly improves the detection accuracy.

8. Using high-quality imported line scan camera, the detection efficiency is 20% higher than that of traditional blind hole inspection machine.

Customized hotline：

136 3150 2760

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project	specifications
Size	L2190mm * W1400mm * H820mm
Model	HYTC-730
Data format	Excellon II, Hitachi, S&M
Check the size of the board	730 x660 (28)"
Lens resolution	3 microns
Detect the aperture range of the cicuit board	30-300 μm
Detect the hole depth range of the circuit board	30-200 μm
Board thickness	0.025 7.5 mm
Suitable for plates	After micro etching of copper foil
Applicable board type	Conformal, DLD, ABF, UV
Detection speed	43s / 16.3 "x 20.3"
Number of holes that can be detected	> 2 million holes per piece
Detection categories	Full true color image, offline analysis, XY coordinates, aperture histogram, defect distribution and classification
operating system	Windows 10
power supply	AC380V, 3P, 50HZ, 3.0KW, 10A
atmospheric pressure	5 kg/㎡ (0.5 MPa)
Confirmation of defect	Display CAM image and actual board defect image at the same time
AI	built-in
Applicable test contents	Defects, deflection, leakage, deflection, too large/small copper window and PAD, film, foreign body, residual glue, hole position accuracy caused by ultra-high and insufficient laser energy